下载APP
【单选题】
在集成电路多层布线中，通常采用钨插销连接各层布线的最主要原因（）
A.
钨的导电率比铝更低
B.
钨的刻蚀比铝更容易
C.
采用化学气相沉积法制备的钨具有更好的填孔能力
D.
钨与硅的接触性能更好
举报
参考答案：
参考解析：
刷刷题刷刷变学霸
举一反三
【单选题】A new era is upon us. Call it what you will: the service economy, the information age, the knowledge society. It is all translated to a fundamental change in the way we work. Already we've partly been...
A.
the service industry is relying more and more on the female work force
B.
manufacturing industries are steadily increasing
C.
people find it harder to earn a living by working in factories
D.
most of the job opportunities can now be found in service industry